Reuters: Technology News: New CEO vows Intel will be more responsive in mobile push

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New CEO vows Intel will be more responsive in mobile push May 16th 2013, 18:05 Intel Chief Operating Officer Brian Krzanich poses with a Front Opening Unified Pod, a transport unit for computer chip wafers, with each FOUP containing between 8,000 and 10,000 individual chips, at Intel headquarters in Santa Clara, California March 13, 2012. Credit: Reuters/Robert Galbraith

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